A hermetic glass-silicon package formed using localized aluminum/silicon-glass bonding
نویسندگان
چکیده
منابع مشابه
A Hermetic Glass–Silicon Package Formed Using Localized Aluminum/Silicon–Glass Bonding
A hermetic package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. Less than 0.2 MPa contact pressure with 46 mA current input for two parallel 3.5m-wide polysilicon on-chip microheaters can raise the temperature of the bonding region to 700 C bonding temperature and achieve a strong and reliable bond in 7.5 min. The formation of aluminum oxide with sili...
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ژورنال
عنوان ژورنال: Journal of Microelectromechanical Systems
سال: 2001
ISSN: 1057-7157
DOI: 10.1109/84.946791